JIS C 61191-6:2011 プリント配線板実装―第６部：ＢＧＡ及びＬＧＡのはんだ接合部のボイド評価基準及び測定方法 | ページ 7

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                                                               C 61191-6 : 2011 (IEC 61191-6 : 2010)
参考文献
  [1] JIS C 61191-1:2006 プリント配線板実装−第1部 : 通則−表面実装及び関連する実装技術を用い
           た電気機器及び電子機器用はんだ付け実装要求事項
           注記 対応国際規格 : IEC 61191-1,Printed board assemblies−Part 1: Generic specification−
                 Requirements for soldered electrical and electronic assemblies using surface mount and related
                 assembly technologies(MOD)
  [2] IEC 61190-1-3,Attachment materials for electronic assembly−Part 1-3: Requirements for electronic
           grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
  [3] Qiang Yu, Tadashiro Shibutani, Do-Seop Kim, Yusuke Kobayashi, Jidong Yang and Masaki Shiratori,
         Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints,
         Microelectronics Reliability, 48, 2008, 431-437, 2008
  [4] Qiang Yu, Tadashiro Shibutani, Yusuke Kobayashi and Masaki Shiratori, The effect of voids on thermal
         reliability of BGA lead-free solder joint and reliability detecting standard, Proc. 10th InterSociety Conf.
         on Thermal and Thermomechanical Phenomena in Electronic System (Itherm 2006), pp.1024 -1030, 2006
  [5] Doseop Kim, Qiang Yu, Yusuke Kobayashi, and Tadashiro Shibutani, Effect of voids on thermal fatigue
         reliability of lead free solder joint, Proc. IPACK05, pp.1-6 (IPACK2005-73136) 2005
  [6] M. Wickham, M. Dusek, L. Zou and C. Hunt, Effect of Voiding on Lead-Free Reliability, NPL REPORT
         DEPC MPR 033, APRIL 2005
  [7] Mohammad Yunus, K. Srihari, J.M. Pitarresi, and Anthony Primavera, Effect of voids on the reliability of
         BGA/CSP solder joints, Microelectronics Reliability 43 (2003) 2077-2086
  [8] IPC-7095B (2008): Design and Assembly Process Implementation for BGAs