JIS C 61191-4:2020 プリント配線板実装―第４部：部門規格―端子実装はんだ付け要求事項 | ページ 4

14
C 61191-4 : 2020 (IEC 61191-4 : 2017)
                                          参考文献
     JIS C 60068-2-20 環境試験方法−電気・電子−第2-20部 : 試験−試験T−端子付部品のはんだ付け
        性及びはんだ耐熱性試験方法
      注記 対応国際規格 : IEC 60068-2-20,Environmental testing−Part 2-20: Tests−Test T: Test methods for
            solderability and resistance to soldering heat of devices with leads(IDT)
     JIS C 60068-2-58 環境試験方法−電気・電子−第2-58部 : 表面実装部品(SMD)のはんだ付け性,
        電極の耐はんだ食われ性及びはんだ耐熱性試験方法
      注記 対応国際規格 : IEC 60068-2-58,Environmental testing−Part 2-58: Tests−Test Td: Test methods for
            solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
            devices (SMD)(IDT)
     JIS C 61188-7 プリント配線板及びプリント配線板実装−設計及び使用−第7部 : CADライブラリに
        用いる電子部品の基準点及び配置方向
      注記 対応国際規格 : IEC 61188-7,Printed boards and printed board assemblies−Design and use−Part 7:
            Electronic component zero orientation for CAD library construction(IDT)
     JIS Q 9001 品質マネジメントシステム−要求事項
      注記 対応国際規格 : ISO 9001,Quality management systems−Requirements(IDT)
     JIS Z 3284-1 ソルダペースト−第1部 : 種類及び品質分類
      注記 対応国際規格 : IEC 61190-1-2,Attachment materials for electronic assembly−Part 1-2:
            Requirements for soldering pastes for high-quality interconnects in electronics assembly(MOD)
     IEC 61188-5-1,Printed boards and printed board assemblies−Design and use−Part 5-1: Attachment
        (land/joint)   onsiderations−Generic requirements
     IEC 61188-5-2,Printed boards and printed board assemblies−Design and use−Part 5-2: Attachment
        (land/joint)   onsiderations−Discrete components
     IEC 61188-5-3,Printed boards and printed board assemblies−Design and use−Part 5-3: Attachment
        (land/joint)   onsiderations−Components with gull-wing leads on two sides
     IEC 61188-5-4,Printed boards and printed board assemblies−Design and use−Part 5-4: Attachment
        (land/joint)   onsiderations−Components with J leads on two sides
     IEC 61188-5-5,Printed boards and printed board assemblies−Design and use−Part 5-5: Attachment
        (land/joint)   onsiderations−Components with gull-wing leads on four sides
     IEC 61188-5-6,Printed boards and printed board assemblies−Design and use−Part 5-6: Attachment
        (land/joint)   onsiderations−Chip carriers with J-leads on four sides
     IEC 61189-2,Test methods for electrical materials, printed boards and other interconnection structures and
        assemblies−Part 2: Test methods for materials for interconnection structures
     IEC 61193-1,Quality assessment systems−Part 1: Registration and analysis of defects on printed board
        assemblies
     IEC 61193-3,Quality assessment systems−Part 3: Selection and use of sampling plans for printed board and
        laminate end-product and in-process auditing
     IEC 61340-5-1,Electrostatics−Part 5-1: Protection of electronic devices from electrostatic phenomena−

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                                                               C 61191-4 : 2020 (IEC 61191-4 : 2017)
        General requirements
     IEC/TR 61340-5-2,Electrostatics−Part 5-2: Protection of electronic devices from electrostatic phenomena−
        User guide
     IEC 62326-1,Printed boards−Part 1: Generic specification
     IEC 62326-4,Printed boards−Part 4: Rigid multilayer printed boards with interlayer connections−Sectional
        specification
     IEC 62326-4-1,Printed boards−Part 4: Rigid multilayer printed boards with interlayer connections−Sectional
        specification−Section 1: Capability detail specification−Performance levels A, B and C
     IPC-TM-650,Test Methods Manual
      2.3.25     Detection and measurement of ionizable surface contaminants by resistivity of solvent extract
      2.3.25.1   Ionic Cleanliness Testing of Bare PWBs
      2.3.27     Cleanliness test−residual rosin
      2.3.38     Surface organic contamination detection test
      2.4.22     Bow and twist (percentage)
      2.6.3.3    Surface insulation resistance, fluxes
     IPC-9191,General Guidelines for Implementation of Statistical Process Control (SPC)
     IPC-OI-645,Standard for Visual Optical Inspection Aids
     IPC-SM-817,General Requirements for Dielectric Surface Mounting Adhesives
     IPC-A-610,Acceptability of Electronic Assemblies
     J-STD-001,Requirements for Soldered Electrical and Electronic Assemblies
     J-STD-002,Solderability Tests for Component Leads, Terminations, Lugs Terminals and Wires
     J-STD-003,Solderability Tests for Printed Boards
     J-STD-004,Requirements for Soldering Fluxes
     J-STD-005,Requirements for Soldering Pastes
     J-STD-006,Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for
        Electronic Soldering Applications
     J-STD-020,Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices