JIS C 61191-3:2020 プリント配線板実装―第３部：部門規格―挿入実装はんだ付け要求事項 | ページ 4

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C 61191-3 : 2020 (IEC 61191-3 : 2017)
        General requirements
     IEC/TR 61340-5-2,Electrostatics−Part 5-2: Protection of electronic devices from electrostatic phenomena−
        User guide
     IEC 62326-1,Printed boards−Part 1: Generic specification
     IEC 62326-4,Printed boards−Part 4: Rigid multilayer printed boards with interlayer connections−Sectional
        specification
     IEC 62326-4-1,Printed boards−Part 4: Rigid multilayer printed boards with interlayer connections−Sectional
        specification−Section 1: Capability detail specification−Performance levels A, B and C
     IEC/PAS 62326-7-1,Performance guide for single- and double-sided flexible printed wiring boards
     IPC-TM-650,Test Methods Manual
      2.3.25     Detection and measurement of ionizable surface contaminants by resistivity of solvent extract
      2.3.25.1   Ionic Cleanliness Testing of Bare PWBs
      2.3.27     Cleanliness test−residual rosin
      2.3.38     Surface organic contamination detection test
      2.4.22     Bow and twist (percentage)
      2.6.3.3    Surface insulation resistance, fluxes
     IPC-9191,General Guidelines for Implementation of Statistical Process Control (SPC)
     IPC-OI-645,Standard for Visual Optical Inspection Aids
     IPC-SM-817,General Requirements for Dielectric Surface Mounting Adhesives
     IPC-A-610,Acceptability of Electronic Assemblies
     J-STD-001,Requirements for Soldered Electrical and Electronic Assemblies
     J-STD-002,Solderability Tests for Component Leads, Terminations, Lugs Terminals and Wires
     J-STD-003,Solderability Tests for Printed Boards
     J-STD-004,Requirements for Soldering Fluxes
     J-STD-005,Requirements for Soldering Pastes
     J-STD-006,Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for
        Electronic Soldering Applications
     J-STD-020,Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices